Patent · US Active

Semiconductor component and method of producing a semiconductor component

US9634207B2 · kind B2 · utility

0Cited by

2References

6Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Michael Kruppa · Geisenfeld, DE
Simon Jerebic · Regensburg, DE

Key dates

Filing date	May 5, 2016
Grant date	Apr 25, 2017
Priority date	—
Expiry date	May 5, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.