Light emitting device package and light unit
US9634215B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2015 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Oct 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.