Chip antenna and manufacturing method thereof
US9634384B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2011 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Jul 15, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
After a three-dimensional antenna pattern (10) is formed by bending a conductive plate, the three-dimensional antenna pattern (10) thus bent is supplied in an injection molding die set as an insert component and a base (20) is formed by injection molding of a resin. With this, a chip antenna (1) comprising the three-dimensional antenna pattern (10) can be formed easier as comparison to a case where the antenna pattern is formed over a plurality of surfaces by printing and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.