Board level electromagnetic interference (EMI) shields with increased under-shield space
US9635789B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2015 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Apr 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0073
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.