Label for in-mold forming
US9636857B2 · kind B2 · utility
4Cited by
3References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2005 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Mar 22, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1352
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A label for in-mold forming comprising a thermoplastic resin film with a heat-sealable layer, a printable thermoplastic resin film, and an antenna and an IC chip. The antenna and the IC chip are interposed between the thermoplastic resin films. The label is strong and water resistant with a high adhesive strength. The label has the function of an IC label and has a printable surface. Also provided is a thermoplastic resin container bearing the label. Bonding the label to a thermoplastic resin container does not damage the IC chip and antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.