Sealless cooling device having manifold and turbulator
US9638477B1 · kind B1 · utility
13Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2015 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Nov 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling device configured to be connected to an object having a surface is disclosed. The cooling device may include a manifold configured to be deposited directly onto the surface of the object, wherein the manifold includes a first side configured to be deposited directly onto the surface of the object, a cavity formed in the first side, an inlet channel fluidly connected to the cavity, and an outlet channel fluidly connected to the cavity. The cooling device may further include a turbulator configured to be deposited directly onto the surface of the object, wherein the turbulator extends into the cavity of the manifold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.