Heat dissipation structure of wearable electronic device
US9639120B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2014 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Jun 13, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation structure of wearable electronic device includes a wearable main body and a wearable strap body connected with the wearable main body. The wearable main body includes a receiving space, a circuit board and multiple electronic components arranged on the circuit board. At least one of the electronic components is a heat source. The wearable strap body has a heat conduction section and a protection section enclosing the heat conduction section. A section of the heat conduction section is exposed to an interior of the receiving space without being enclosed by the protection section. The exposed section of the heat conduction section is in contact with the corresponding heat source on the circuit board so as to greatly enhance the heat dissipation performance of the wearable electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.