Grounded die seal integrated circuit structure for RF circuits
US9640494B1 · kind B1 · utility
3Cited by
3References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 21, 2016 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Apr 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) structure for radio frequency circuits having a grounded die seal that mitigates the effects of parasitic coupling through the die seal. Embodiments include conductive grounding ties that each electrically couple one or more of the internal grounding pads on an IC die within the magnetic loop formed by the die seal ring to an adjacent extent of an IC die seal. Induced parasitic energy within the die seal ring is quickly coupled to ground through the corresponding grounding ties and grounding pads. Accordingly, very little, if any, induced parasitic energy is propagated around the die seal ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.