Wire bonding apparatus comprising an oscillator mechanism
US9640512B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2015 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Jul 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.