Compact opto-electronic modules and fabrication methods for such modules
US9640709B2 · kind B2 · utility
4Cited by
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17Claims
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Key dates
| Filing date | Aug 20, 2014 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Aug 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0363
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A wafer-level method of fabricating optoelectronic modules performing a first vacuum injection technique, using a first vacuum injection tool, to surround optoelectronic devices laterally with a transparent overmold region, performing a replication technique to form a respective passive optical element on a top surface of each overmold region, and performing a second vacuum injected technique to form sidewalls laterally surrounding and in contact with sides of each overmold region. The replication technique and the second vacuum injection technique are performed using a combined replication and vacuum injection tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.