Method for manufacturing display element, display element, and display device

US9640718B2 · kind B2 · utility

Assignee

• Kabushiki Kaisha Toshiba · JP

Inventors

• Kentaro Miura · Yokohama, JP
• Tatsunori Sakano · Shinagawa, JP
• Tomomasa Ueda · Yokohama, JP
• Nobuyoshi Saito · Kozushima, JP
• Shintaro Nakano · Toyota, JP
• Yuya Maeda · Kawasaki, JP
• Hajime Yamaguchi · Kawasaki, JP

Key dates

• Filing date: Feb 4, 2014
• Grant date: May 2, 2017
• Expiry date: Sep 24, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K71/851

Abstract

According to one embodiment, a method for manufacturing a display element is disclosed. The method can include forming a peeling layer, forming a resin layer, forming a barrier layer, forming an interconnect layer, forming a display layer, and removing. The peeling layer is formed on a major surface of a base body. The major surface has first, second, and third regions. The peeling layer includes first, second, and third peeling portions. The resin layer is formed on the peeling layer. The resin layer includes first and second resin portions. The barrier layer is formed on the first, second, and third peeling portions. The interconnect layer is formed on the barrier layer. The display layer is formed on the interconnect layer. The first peeling portion is removed from the first resin portion and the second peeling portion is removed from the second resin portion.