Silane endcapped polyamide resins
US9644114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2016 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Apr 20, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/455
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed herein are compounds having the formula: R1—(CO—NH—R2—R3)n and polymers made by moisture curing the compound. R1 is an organic group, a dimeric fatty acid chain, a dimeric linoleic fatty acid chain, a trimeric fatty acid chain, a saturated form of any thereof, a residue of a phenalkamine compound, or a residue of a polyamine. Each R2 is an aliphatic group or an aminoaliphatic group. Each R3 comprises an alkoxysilane group. The value n is a positive integer. The compound may be made by reacting a polyester with an amine having an alkoxysilane group or reacting a polyacid with an isocyanate having an alkoxysilane group. Also disclose are compounds made by reacting an amido amine with an epoxy compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.