Patent · US Active

Adhesives suitable for use in bonding applications

US9644121B2 · kind B2 · utility

0Cited by

5References

11Claims

0Family size

Assignees

Henkel AG & Co. KGaA · DE
HENKEL IP & HOLDING GMBH · DE

Inventors

Darren Nolan · Dublin, IE
Nigel Fay · Goldkronach, DE
Eimear Fleming · Dublin, IE
Brendan Kneafsey · Lucan, IE
Rainer Wefringhaus · Hilden, DE
Wolfgang Weimar · Hanau, DE

Key dates

Filing date	Mar 12, 2013
Grant date	May 9, 2017
Priority date	—
Expiry date	May 26, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31515
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present invention relates to adhesives that are suitable for use in a broad variety of bonding applications. In particular, the present invention relates to adhesives that are suitable for use in polymer-to-metal, for example elastomer-to-metal, such as rubber-to-metal bonding applications, wherein the adhesives comprise at least one halogenated polyolefin, at least one epoxysilane having at least one terminal alkoxy silane group, at least one bis-silane, and optionally at lease one organic solvent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.