Detection system for detecting a soldered joint

US9645098B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Stefan Scheller · Lorsch, DE
• Torsten Hundert · Salzgitter, DE
• Marco Braun · Bukit Mertajam, MY

Key dates

• Filing date: May 26, 2014
• Grant date: May 9, 2017
• Expiry date: May 26, 2034

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2201/061
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

The invention relates to a detection system (1) for detecting a soldered joint (16, 17) of an electronic component (10), particularly an integrated circuit. The component comprises a cuboid enclosure. The detection system comprises a detection device (2) with an emitter (5) for electromagnetic radiation and a detector (6) for the electromagnetic radiation. The detection device is designed to generate electromagnetic radiation (18, 19) with the emitter and to transmit said radiation to the component. The detector is arranged and designed to detect electromagnetic radiation (18′, 19′) reflected by the component and to generate an image data set representing the reflected radiation. The detection device is designed to generate from the image data set at least one edge data set representing one edge of the component and to determine in the region of the edge data set, particularly of an image region of the image data set representing the edge, at least one part of the image data set representing a soldered joint and to generate and output a quality signal representing a quality of the soldered joint on the basis of an intensity value, particularly a brightness or grey value of the part…