Systems and methods for haptic feedback for modular devices
US9645647B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 13, 2015 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Jul 9, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/014
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
One illustrative haptic output device disclosed herein includes a connector configured to couple the haptic output device to a modular computing device. The modular computing device includes an outer housing configured to mechanically and electrically couple with one or more external electronic modules. The haptic output device also includes a receiver configured to receive a haptic signal from a processor. The processor is configured to receive a signal; determine a haptic effect based in part on the signal; generate the haptic signal based on the haptic effect; and transmit the haptic signal. The haptic output device is configured to output the haptic effect responsive to receiving the haptic signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.