Integrated circuit with inductive bond wires
US9646947B2 · kind B2 · utility
2Cited by
44References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2009 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Jul 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) that includes a semiconductor die in an IC package. The semiconductor die includes an electrical endpoint. The IC also includes a pad affixed to the semiconductor die. The pad is characterized by a capacitance and is coupled to the electrical endpoint. The IC also includes a bond wire coupling the pad to an IC package pin. The bond wire is an inductor characterized by an inductance. The inductance is configured to decrease signal degradation caused by the capacitance of the pad on electrical signals transmitted between the pin and the electrical endpoint of the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.