Method for manufacturing array substrate and array substrate manufactured therefor
US9647015B2 · kind B2 · utility
1Cited by
3References
8Claims
0Family size
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Key dates
| Filing date | Jul 31, 2015 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Jul 31, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/124
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for manufacturing an array substrate is disclosed and includes steps of: sequentially forming a first metal layer, an insulating layer and a second metal layer on a glass substrate; forming a passivation layer on the second metal layer; performing a first etching process on the passivation layer to obtain a first groove and a second groove; performing a second etching process on the passivation layer to obtain a third groove; and forming a pixel electrode layer on the passivation layer. The method saves one photomask and a photolithography step, thereby reducing the cost and improving the efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.