Patent · US Active

Method for producing an electronic component and electronic component

US9647186B2 · kind B2 · utility

2Cited by
12References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 24, 2014
Grant dateMay 9, 2017
Priority date
Expiry dateSep 4, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate with at least one functional layer, applying at least one first barrier layer on the functional layer via plasma enhanced atomic layer deposition (PEALD), and applying at least one second barrier layer on the functional layer by means of plasma-enhanced chemical vapor deposition (PECVD), where the at least one first barrier layer is applied at a temperature of less than 100° C.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.