Multi-slice two-dimensional phased array assembly
US9647187B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2014 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Jan 19, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/0151
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A two-dimensional phased array beam former comprising at least first and second chips having each top and bottom surfaces, the bottom surface of the first chip being attached to the top surface of the second chip; the first and second chips having each an emitter side surface, the emitter side surfaces of the first and second chips facing a same direction and comprising each a plurality of emitters; wherein each of said first and second chips comprises at least one conductive post extending between said top and bottom surfaces; the at least one conductive post of the first chip being vertically aligned with and connected to the at least one conductive post of the second chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.