Wafer-level package and method for production thereof

US9647196B2 · kind B2 · utility

Assignee

• SnapTrack, Inc. · US

Inventors

• Christian Bauer · Neu-Ulm, DE
• Hans Krueger · Munich, DE
• Juergen Portmann · Peising, DE
• Alois Stelzl · Munich, DE
• Wolfgang Pahl · Munich, DE
• Robert Koch · Munich, DE

Key dates

• Filing date: Mar 28, 2012
• Grant date: May 9, 2017
• Expiry date: Jan 14, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/42
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.