Semiconductor device
US9648732B2 · kind B2 · utility
1Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2014 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Jan 2, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a conductive-patterned insulating substrate; conductive blocks fixed to conductive patterns of the conductive-patterned insulating substrate; a semiconductor chip fixed to each conductive block; a printed circuit board that has a conductive post fixed to the semiconductor chip; and a resin. The semiconductor device is configured such that the average volume of a conductive film per unit area of each conductive pattern around a section thereof, to which the corresponding conductive block is fixed, is reduced from the conductive block toward the outside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.