Integrated circuit device system with elevated stacked configuration and method of manufacture thereof
US9648754B1 · kind B1 · utility
1Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2014 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Sep 1, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method of manufacture of an integrated circuit device system includes: a module interposer having a module first side and a module second side; an outer chip assembly mounted to the module first side; a mirrored chip assembly mounted to the module second side, the mirrored chip assembly below the outer chip assembly; and a carrier attached to the module second side, the carrier includes a carrier first side and a carrier second side, the mirrored chip assembly suspended above the carrier first side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.