Patent · US Active

Method and apparatus for forming a structure on a substrate

US9649729B2 · kind B2 · utility

1Cited by
5References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 9, 2015
Grant dateMay 16, 2017
Priority date
Expiry dateOct 9, 2035

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C4/134
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Presented is a method for forming at least one structure on a substrate. Utilizing a low-temperature plasma jet, powder, of which the structure shall be constructed, is applied to a surface of the substrate. Using at least one laser beam, heat is input into the substrate and/or the powder within a laser incidence region on the substrate. The heat input delays solidification of the powder particles, which are partly or fully melted in the plasma jet, on the substrate and thereby enables the formation of good adhesion between the applied powder, and thus the structure constructed out of the powder, and the substrate. The invention further relates to an apparatus for performing the method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.