Method for producing a sensor, and sensor
US9649796B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 10, 2012 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Aug 9, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/34
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method for producing a sensor. In the method, a sensor element having an IC is pre-overmolded to produce a preform, wherein the preform is designed in such a way that the preform can accommodate electrical contacts for the sensor having various dimensions and/or in various positions by press fitting. The electrical contacts are pressed into holes/recesses of the preform, the connections of the IC of the sensor are connected to the electrical contacts, and the preform is inserted into an injecting mold and is overmolded to produce the finished sensor. In this way, sensors for different applications can be produced in a substantially standardized manner. The invention further relates to a sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.