Polyimide precursor composition, method of producing polyimide precursor composition, method of producing polyimide molded article, polyimide molded article, liquid crystal alignment film, passivation film, wire coating material, and adhesive film
US9650550B2 · kind B2 · utility
12Cited by
2References
13Claims
0Family size
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Key dates
| Filing date | Apr 28, 2014 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Apr 28, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B1/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide precursor composition includes a resin having a repeating unit represented by the following Formula (I) and having an imidization ratio equal to or less than 0.2, a cyclic amine compound, and an acyclic aliphatic amine compound, wherein the resin, the cyclic amine compound, and the acyclic aliphatic amine compound are dissolved in an aqueous solvent:wherein in Formula (I), A represents a tetravalent organic group and B represents a divalent organic group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.