Encapsulation of high temperature molten salts
US9650556B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Jan 24, 2013 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Jun 7, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2989
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure relates to a method of encapsulating microcapsules containing relatively high temperature phase change materials and the microcapsules so produced. The microcapsules are coated with an inorganic binder, film former and an inorganic filler. The microcapsules may include a sacrificial layer that is disposed between the particle and the coating. The microcapsules may also include an inner coating layer, sacrificial layer and outer coating layer. The microcapsules are particularly useful for thermal energy storage in connection with, e.g., heat collected from concentrating solar collectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.