Device including multi-function circuitry having optical detectors and method of flip-chip assembly therefor
US9651421B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2010 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Oct 5, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V8/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device includes a substrate is substantially transparent and includes a contact surface and an interface surface. The interface surface includes a plurality of electrical contacts. The device further includes a semiconductor die, which includes a plurality of connections, a first photo detector and a second photo detector. Each of the plurality of connections includes a connection bump formed thereon to couple to the plurality of electrical contacts of the interface surface of the substrate. The plurality of connections positioned relative to the first and second photo detectors to alter a directional response of at least one photo detector of the plurality of photo detectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.