Substrate
US9655240B2 · kind B2 · utility
0Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2013 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Oct 23, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.