Casing of electronic device and method of manufacturing the same
US9655261B2 · kind B2 · utility
8Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2014 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Sep 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface. A plurality of apertures are formed on the inner surface of the metallic housing. A non-conductive layer is formed on the inner surface of the metallic housing, and part of the non-conductive layer is extended into the apertures. The outer surface of the metallic housing is dyed to form the casing of the electronic device. A casing of an electronic device is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.