Removal of selected portions of protective coatings from substrates
US9656350B2 · kind B2 · utility
3Cited by
6References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Sep 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.