Device for gripping substrate without contact
US9656368B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 11, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | May 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67126
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device for gripping a substrate without contact with which the substrate can be more securely transported. In the device, a housing cap has an air inlet in the upper surface and a lower opening, the lower opening communicating with the air inlet such that air introduced through the air inlet exits through the lower opening. A contour of the lower opening in its vertical cross section is convexly rounded such that the introduced air is guided along a horizontal undersurface of the housing cap. A nozzle is disposed in an inner hollow space of the housing cap, and has an inclined surface such that the width of the nozzle gradually decreases in the direction from the undersurface of the nozzle to the upper surface of the nozzle adjacent to the air inlet. The undersurface of the nozzle is at a predetermined distance from the inner surface of the housing cap. An ultrasonic shaker applies ultrasonic vibration to the housing cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.