Measuring tire pressure in a tire mold
US9656434B2 · kind B2 · utility
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15References
15Claims
0Family size
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Key dates
| Filing date | Nov 30, 2010 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Apr 5, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2030/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Pressure sensors may be used to directly measure the pressure between a green tire and a curing apparatus during shaping and/or during curing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.