Apparatus for laminating substrates
US9656450B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 2, 2008 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Sep 5, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B37/0046
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for laminating substrates includes a laminating fixture having an open-topped recessed space formed by a pair of corresponding sidewalls for holding a target substrate therein. The recessed space is communicable with an air evacuation passage. A supporting structure is formed in the recessed space for supporting two opposite ends of a flexible substrate thereon, such that a bottom of the flexible substrate is spaced from a laminating surface of the target substrate by a predetermined distance. A soft plate is disposed over the open-topped laminating fixture to form an airtight chamber in the laminating fixture. When the airtight chamber is vacuumed using a vacuum pump via the evacuation passage, the soft plate is subjected to a suction pressure and downward deformed to press the flexible substrate downward, causing the flexible substrate to deflect to attach its bottom on the laminating surface of the target substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.