Method for fabricating transfer printing substrate using concave-convex structure, transfer printing substrate fabricated thereby and application thereof
US9656502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Aug 7, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24529
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. The present invention allows a process of manufacturing a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.