Low expansion glass filler, method of manufacturing the same and glass frit including the same
US9656907B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Oct 21, 2013 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Feb 18, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2982
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A low expansion glass filler which minimizes reflection of laser light during hermetic sealing, a method of manufacturing the same and a glass frit including the same. The low expansion glass filler includes SiO2, Al2O3, B2O3 and CaCO3, the transmittance of the low expansion glass filler being 80% or greater at a wavelength ranging from 630 to 920 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.