Inorganic adhesive composition and hermetic sealing method using same
US9656908B2 · kind B2 · utility
1Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2013 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Jun 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/8426
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to an inorganic adhesive composition and to a hermetic sealing method, and more specifically relates to an inorganic adhesive composition with which an organic solvent is not used and to a hermetic sealing method using same. To this end, the present invention provides an inorganic adhesive composition comprising: between 20 and 80 parts by weight of a water glass diluted solution containing between 60 and 90 parts by weight of water glass (Na2SiO2); between 20 and 80 parts by weight of a refractory inorganic filler; and a black pigment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.