Polyamide hardeners for epdxy resins
US9656977B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2013 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Nov 25, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide composition comprising a reaction product of: a) an excess of a polyfunctional amine; b) a dimer fatty acid; and c) a monomer fatty acid is disclosed. The polyamide composition can be used as a hardener in epoxy resin formulations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.