Anti-foaming agents for hot-melt adhesives
US9657199B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 6, 2012 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Jan 10, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J177/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide hot melt adhesive composition is described comprising the polyamide condensation product of substantially equimolar quantities of: (a) an acid component consisting essentially of one or more polymeric fatty acids and one or more dicarboxylic acids, and (b) an amine component consisting essentially of one or more cyclic aliphatic diamines, one or more non-cyclic aliphatic diamines in which the amine groups are bonded to odd-numbered carbon atoms on the aliphatic chain, and one or more alkylene diamines, and (c) an anti-foaming or defoaming agent comprised of a water based silicone compound comprising 5% solids in water wherein the defoaming agent reduces or eliminates foaming occurring during the condensation reaction providing the condensation product and (d) an acid based catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.