Patent · US Active

Adhesive formulations

US9657206B2 · kind B2 · utility

2Cited by
9References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 24, 2013
Grant dateMay 23, 2017
Priority date
Expiry dateAug 9, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31587
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

The present invention relates to adhesive formulations based on uretdione-group-comprising polyaddition compounds that are free of isocyanate groups and monomeric polyisocyanates, and to the use thereof for the production of adhesive bonds between substrates, in particular for the production of flexible film composites.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.