Adhesive formulations
US9657206B2 · kind B2 · utility
2Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2013 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Aug 9, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31587
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to adhesive formulations based on uretdione-group-comprising polyaddition compounds that are free of isocyanate groups and monomeric polyisocyanates, and to the use thereof for the production of adhesive bonds between substrates, in particular for the production of flexible film composites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.