Non-contact thermal sensor module
US9658109B2 · kind B2 · utility
2Cited by
3References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2014 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Mar 12, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Compact thermal sensor modules, which in some implementations can be manufactured in wafer-level fabrication processes, include features composed of or coated with a low-emissivity material to reduce or prevent detection by a sensor of radiation emitted by other parts of the module. For example, spacers that separate an optics substrate and a sensor package from one another can be composed of or coated with such a low emissivity material. In some cases, the low emissivity material has an emissivity of no more than 0.1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.