Cover for electronic device and method for manufacturing the same
US9658656B2 · kind B2 · utility
2Cited by
4References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 31, 2014 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Mar 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/023
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A cover for an electronic device includes a main portion and a border portion beside the main portion. The border portion includes a transparent substrate and a adhesive layer. The transparent substrate defines at least one through hole. The adhesive layer is adhered to an inner wall of the at least one through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.