Method of manufacturing an electronic device
US9659582B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 25, 2013 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Mar 26, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic device includes a positioning step of positioning a first member supporting a laser diode with respect to a second member having a waveguide, a bonding step of bonding the first member and the second member together, and a checking step of checking the accuracy of positioning of the first member with respect to the second member. In the positioning step, the laser diode is energized to allow laser light to be emitted, and the laser light is allowed to be incident on the incidence end of the waveguide. In the bonding step, a bonding material is melted by irradiating the first member with heating light while the laser diode is not energized. In the checking step, the laser diode is energized again.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.