Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
US9659682B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2014 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Nov 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1157
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern on a variety of polymer resin products or resin layers by a significantly simple process, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern includes: a polymer resin; and a non-conductive metal compound including at least one of first and second metals as a predetermined non-conductive metal compound including the first and second metals, wherein a metal core including the first or second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.