Semiconductor devices and methods of manufacturing the same
US9659772B2 · kind B2 · utility
1Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Dec 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B43/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices and methods of manufacturing the semiconductor devices are provided. The semiconductor devices may include a first line pattern that includes a first main line having a first width and a first subline having a second width, and a second line pattern that includes a second main line having the first width and a second subline having a third width. The first line pattern may include a first width changer whose width increases from the first width to the second width. The second line pattern may include a second width changer whose width increases from the first width to the third width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.