Integration of chip level micro-fluidic cooling in chip packages for heat flux removal
US9659838B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2016 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Mar 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic chip package including a base defining a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening. A dielectric body is arranged on the base and configured to support an electronic device. The dielectric body comprises a coolant flow chamber formed in a first surface thereof, and a plurality of impingement openings formed within the coolant flow chamber. The plurality of impingement openings are in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber. The body further comprises a coolant return port formed within the coolant flow chamber and in communication with the fluid outlet opening of the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.