Semiconductor device having a guard ring
US9659879B1 · kind B1 · utility
5Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Oct 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor die having a guard ring disposed in a periphery of the semiconductor die. The semiconductor device also includes a conductive pad over the guard ring. the semiconductor device further has a passivation partially covering the conductive pad, and including a recess to expose a portion of the conductive pad and a post passivation interconnect (PPI) over the passivation. In the semiconductor device, a conductor is extended upwardly from the recess and connected to a portion of the PPI.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.