Semiconductor device
US9660014B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 4, 2016 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Feb 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a semiconductor substrate; and a thin film resistor formed over an upper surface of the semiconductor substrate, the thin film resistor including first thin film resistor units and second thin film resistor units alternately connected in series, each of the first thin film resistor units having an elongated main portion and end portions that are connected to the elongated main portion, the end portions each forming a U-shape together with the elongated main portion in a plan view, and respectively overlapping with two of the second thin film resistor units that are adjacent to and connected to the first thin film resistor unit in series.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.