Microelectronic package with surface mounted passive element
US9660017B2 · kind B2 · utility
1Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Oct 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic package includes a packaging substrate having a chip mounting surface; a chip mounted on the chip mounting surface of the packaging substrate with the chip's active surface facing down to the chip mounting surface; a plurality of input/output (I/O) pads distributed on the active surface of the chip; and a discrete passive element mounted on the active surface of the chip. The discrete passive element may be a decoupling capacitor, a resistor, or an inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.