Semiconductor light-emitting device
US9660150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2016 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Apr 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A semiconductor light-emitting device includes a substrate, an LED chip, a control element, a conductive layer and an insulating layer. The substrate, made of a semiconductor material, has an obverse surface and a reverse surface spaced apart from each other in the thickness direction of the substrate. The control element controls light emission of the LED chip. The conductive layer is electrically connected to the LED chip and the control element. The insulating layer is arranged between at least apart of the conductive layer and the substrate. The substrate has a recess formed in the obverse surface, and the LED chip is housed in the recess. The control element is arranged between the LED chip and the reverse surface in the thickness direction of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.