System interconnect for integrated circuits
US9660364B2 · kind B2 · utility
68Cited by
10References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2013 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Jun 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B15/04
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic device for transmitting data is described herein. In some examples, the electronic device includes a package substrate, and a plurality of integrated circuits to be coupled to the package substrate, at least one integrated circuit comprising a topside connector or an edge connector to be coupled to a cable that is to couple to a cable receptacle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.